무선 및 RF 모듈 신제품

Quectel FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules
Quectel FGA66X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to 85°C and are available in an LGA package. The FGA66X modules are ideal for a variety of smart home and industrial applications.