BECOM

BECOM Systems develops innovative sensor solutions, including time-of-flight 3D cameras and a variety of system-on-module solutions.

다음 회사의 주요 제품: BECOM

CM-BF537 Core Module

CM-BF537 Core Module

Offers broad field of application & configuration possibilities, based on Analog Devices ADSP-BF537.

CM-BF548 Core Module

CM-BF548 Core Module

Powered by Analog Devices single core ADSP-BF548 Blackfin® Processor.

TCM-BF537 Tiny Core Module

TCM-BF537 Tiny Core Module

Ideal for industrial temp range & volume production, powered by Analog Devices Blackfin® Processor.

eCM-BF561 Core Module with ADSP-BF561 Blackfin®

eCM-BF561 Core Module with ADSP-BF561 Blackfin®

Optimized for performance & parallel data processing, powered by Analog Devices.