컴퓨터 온 모듈 - COM 신제품
DFRobot DFR1295 LattePanda Mu Ultra x86 Compute Module is a credit-card-sized, high-performance AI compute module designed for edge intelligence, robotics, and embedded computing applications. Powered by an Intel Core Ultra 7 Processor 256V, integrated Intel Arc 140V GPU, and Intel AI Boost NPU, the module delivers up to 115 TOPS of combined AI performance. This processing capability enables local execution of large language models, computer vision, speech processing, and machine learning workloads without requiring cloud connectivity.
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DFRobot DFR1295 LattePanda Mu Ultra x86 Compute ModuleAI compute module designed for edge intelligence, robotics, and embedded computing applications.2026-10-05
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Axiomtek CEM570 COM Express Type 6 ModulesBased on Intel® processor technology and designed for embedded computing applications.2026-07-29 -
Advantech SOM-6873 AMD Ryzen 8000 COM Express 타입 6 모듈게임 애플리케이션용으로 설계되었으며 컴팩트한 타입 6 핀아웃 설계가 특징입니다.2025-08-25 -
Ka-Ro Electronics QSMP2 Solder-Down Computer On ModulesFeature up to 60x 3.3V general purpose I/O and LVDS display interface.2025-03-21 -
Advantech SOM-7533COM Express®MiniType10 모듈인텔®코어™i3, N 시리즈 및 Atom®x7000 시리즈 프로세서(Alder Lake-N/Amston Lake)로 구축되었습니다.2025-01-30 -
ADLINK Technology Nvidia RTX 임베디드 MXM 모듈Ampere 아키텍처로 구동되는 NVIDIA 임베디드 그래픽이 특징입니다.2024-06-06 -
ADLINK Technology Nvidia Quadro T1000 임베디드 MXM 모듈Turing™ 아키텍처를 기반으로 구축된 NVIDIA 임베디드 그래픽이 특징입니다.2024-06-03 -
DFRobot LattePanda Mu Micro x86 컴퓨팅 모듈Intel N100 쿼드 코어 프로세서, 8GB LPDDR5 메모리, 64GB 스토리지가 특징입니다.2024-05-28 -
Advantech ROM-2620 OSM 1.1 컴퓨터 온 모듈NXP i.MX 8ULP SoC로 구동되는 OSM 1.1 컴퓨터 온 모듈.2024-05-10 -
NexAIoT ICES622X Computer-On-Module (COM)COM Express Type 6 compact-size module that features Intel® Atom™ X6000 processors.2024-03-23 -
NexAIoT SMC250 SMARC 2.1 Computer-On-Module (COM)Features an Intel Atom® x5-E3940 Quad Core processor in an 82mm x 50mm short-size module dimension.2024-01-17 -
Ka-Ro Electronics QFN Style Solder-Down Computer On ModuleSingle-sided, assembled in a small square size of 27mm and a height of 2.6mm.2024-01-07 -
Ka-Ro Electronics TXMP2 Computer On ModulePart of the TX family and includes an STM32MP255 processor with 1.5 GHz dual Arm® Cortex®-A35.2024-01-07 -
Ka-Ro Electronics TX91 Computer On ModuleComplete computer implemented on a board smaller than a credit card.2024-01-07 -
ADLINK Technology Express-RLP COM Express 기본 크기 타입 6 모듈13세대 Intel® Core™ 모바일 프로세서를 기반으로 하는 Type 6 기본 크기 모듈입니다.2023-12-21 -
NexAIoT ICES676S Computer-On-Module (COM)COM Express Type 6-pinouts basic module that supports 12/13th Generation Intel® Core™ processors.2023-11-09 -
ADLINK Technology Express-ADP 타입 6 모듈혁신적인 하이브리드 아키텍처를 갖춘 12세대 Intel ® Core ™ 프로세서로 구동됩니다.2023-08-23 -
ADLINK Technology Express-ID7 모듈최대 4x 10G용 고속 이더넷이 통합된 Intel ® Xeon ® D-1700 프로세서를 기반으로 합니다.2023-08-23 -
Ka-Ro Electronics TX93 Computer-on-Module (COM)Features a 1.5GHz Dual ARM® Cortex®-A55 processor based on the NXP i.MX 93.2023-07-20 -
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module100-pin QFN lead-styled module measures 27mm2 x 2.6mm in height and provides a single-sided assembly2023-07-20 -
congatec COMe-cAP6 COM Express® w/ Intel® Core™ ProcessorsBoasts the power of 12th Generation Intel Core Processors, supporting up to 64GByte LPDDR5 memory.2023-04-01 -
ADLINK Technology Express-TL COM Express 기본 크기 타입 6 모듈11세대 Intel® Core™, Xeon® W 및 Celeron® 6000 프로세서를 기반으로 합니다.2023-02-02 -
ADLINK Technology cExpress-TL COM Express 타입 6 모듈16GT/s에서 PCI Express Gen 4와 최대 10Gb/s의 전송 속도로 4개의 USB 3.2 포트를 지원합니다.2023-02-02