congatec CPU 및 칩 냉각기

결과: 101
선택 이미지 부품 번호 제조업체 설명 데이터시트 구매 가능 정보 가격 (KRW) 수량에 따라 단가별로 테이블의 결과를 필터링합니다. 수량 RoHS ECAD 모델 높이 깊이 너비 작동 공급 전압 전력 정격 시리즈


congatec CPU 및 칩 냉각기 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. 8재고 상태
최소: 1
배수: 1

congatec HPC/sILH-CSA-HP-T
congatec CPU 및 칩 냉각기 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. 1재고 상태
최소: 1
배수: 1
32.9 mm 12 V
JUMPtec CPU 및 칩 냉각기 COMe Active Uni Cooler (w/o HSP) 43재고 상태
최소: 1
배수: 1
14 mm 78 mm 87 mm 20 W
congatec CPU 및 칩 냉각기 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole. 2재고 상태
최소: 1
배수: 1

conga-MA7 Intel Elkhart Lake
congatec CPU 및 칩 냉각기 *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded 2재고 상태
최소: 1
배수: 1
conga-PA7 Intel Elkhart Lake
congatec CPU 및 칩 냉각기 * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole 비재고 리드 타임 8 주
최소: 1
배수: 1

conga-SA7 Intel Elkhart Lake
congatec CPU 및 칩 냉각기 Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2재고 상태
최소: 1
배수: 1
27.3 mm 12 V conga-JC370
JUMPtec CPU 및 칩 냉각기 HSK COMe-Basic active (w/o HSP) 7재고 상태
81주문 중
최소: 1
배수: 1
congatec CPU 및 칩 냉각기 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3재고 상태
최소: 1
배수: 1
27.3 mm 12 V conga-JC370
congatec CPU 및 칩 냉각기 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread 11재고 상태
최소: 1
배수: 1

conga-TCA7 Intel Elkhart Lake
congatec CPU 및 칩 냉각기 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole. 5재고 상태
최소: 1
배수: 1

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec conga-TCR8/CSA-HP-B
congatec CPU 및 칩 냉각기 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. 1재고 상태
최소: 1
배수: 1

congatec HPC/cALP-CSA-HP-B
congatec CPU 및 칩 냉각기 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1재고 상태
최소: 1
배수: 1
29 mm 12 V
JUMPtec CPU 및 칩 냉각기 COMe Active Uni Cooler2 (w/o HSP) 53재고 상태
최소: 1
배수: 1

JUMPtec 51099-0000-99-1
JUMPtec CPU 및 칩 냉각기 SMARC Passive Uni Cooler (w/o HSP) 105재고 상태
최소: 1
배수: 1
JUMPtec CPU 및 칩 냉각기 HSP COMe-cAP6 Cu-core threaded
1주문 중
최소: 1
배수: 1

congatec conga-HPC/mRLP-CSA-B
congatec CPU 및 칩 냉각기 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
2예상 2026-07-21
최소: 1
배수: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU 및 칩 냉각기 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
2예상 2026-07-21
최소: 1
배수: 1

congatec conga-HPC/mRLP-CSP-B
congatec CPU 및 칩 냉각기 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
2예상 2026-08-20
최소: 1
배수: 1

congatec CPU 및 칩 냉각기 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded 비재고 리드 타임 12 주
최소: 1
배수: 1

conga-MA7 Intel Elkhart Lake
JUMPtec CPU 및 칩 냉각기 HSP COMe-cAP6 Cu-core through 재고 없음
최소: 1
배수: 1

JUMPtec CPU 및 칩 냉각기 COMe Passive Uni Cooler (w/o HSP) N/A
최소: 1
배수: 1

14 mm 78 mm 87 mm
JUMPtec CPU 및 칩 냉각기 COMe Passive Uni Cooler2 slim (w/o HSP) 재고 없음
최소: 1
배수: 1

JUMPtec CPU 및 칩 냉각기 COMe Passive Uni Cooler2 (w/o HSP) 재고 없음
최소: 1
배수: 1

JUMPtec CPU 및 칩 냉각기 HSK COMe-Basic passive (w/o HSP) 비재고 리드 타임 28 주
최소: 1
배수: 1