Wakefield Thermal ulTIMiflux Gap Pad Evaluation Kit
Wakefield Thermal ulTIMiflux Gap Pad Evaluation Kit features excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs). This kit offers good electrical insulation performance, flexibility, and a high compression ratio. Thermal pads for the ulTIMiflux are used for filling the voids between a heat source and heat sink, effectively blocking air from the contact interface. Wakefield Thermal ulTIMiflux TIMs for this kit have a 1.5W/mk to 14W/mK performance range, 1mm thickness, and 3" x 5" dimensions.
Features
- Wide operating temperature range
- Excellent flame retardance
- Good electrical insulation performance
- Good flexibility and high compression ratio
Applications
- Semiconductor heat sinks
- Thermal imaging equipment
- Military electronic products
- Vehicle navigation equipment
- Communication and power equipment
- Graphics cards, memory modules
- LED lighting equipment
- HDTVs
Example of Kit Contents
Illustration Example
Related Products
Wakefield Thermal ulTIMiFlux Thermal Gap Filling Pads
A variety of sizes, thicknesses, conductivities, and durometers for a custom thermal solution.
게시일: 2022-03-11
| 갱신일: 2025-12-01