Ka-Ro Electronics QSXP Computer-On-Module (COM)
Ka-Ro Electronics QSXP Computer-On-Module (COM) is a QFN-style module based on the NXP Semiconductors i.MX 8M Plus Processor. Optimized for machine learning and vision, advanced multimedia, and industrial IoT applications, the QSXP integrates a Neural Processing Unit (NPU) operating at up to 2.3 TOPS. Dual Image Signal Processors and two camera inputs enable an effective Vision System. Additional peripheral interfaces include Gb Ethernet, PCIe, USB 2.0 and 3.0, dual CAN FD, I2C, SPI, and PWM. The COM also includes 2GB LPDDR4 SDRAM and 8GB eMMC Flash memory.The Ka-Ro Electronics QSXP COM has a 29.0mm x 29.0mm form factor, with a 2.6mm total height. The COM has a QFN-type lead style, with a 1mm pitch, 108 pads, and a large exposed pad for enhanced thermal performance.
Features
- NXP Semiconductors i.MX 8M Plus Processor
- Quad Cortex-A53 up to 1.6GHz
- Cortex-M7 up to 800MHz
- Memory
- 2GB LPDDR4 SRAM
- 8GB eMMC Flash
- Display support
- MIPI DSI (4-lane)
- GC520L 2D GPU
- GC7000UL 3D GPU
- 1080p60 video decode/encode
- Vision and Machine Learning
- 2x MIPI-CSI (4-lane each)
- Dual Camera ISP (2x HD/1x 12MP) HDR, dewarp
- Machine Learning Accelerator: 3 TOPS
- Tensilica® HiFi4 DSP up to 800MHz
- Connectivity
- 1x USB 0, 1x USB 2.0
- 1x Gb Ethernet with IEEE® 1588, AVB, TSN
- 1x PCIe® Gen 3 – 1-lane
- 3x UART, 2x I2C, 2x SPI, PWM, SAI
- Up to 60x 3.3V General Purpose I/O
- OS support
- Linux
- Industrial grade -30°C to +85°C operating temperature range
- QSX extended 2nd generation QS module series
- QS pin-compatible solder-down version
- 29mm square
- 6mm total height
- QFN-type lead style
- 1mm pitch
- 108 pads
- Thermal pad
- Visual solder joint inspection possible after soldering
- Single-sided assembly
- 3V to 5V power supply (-5%/+10%)
Applications
- Machine learning and vision
- Automation
- Medical technology
- Industrial control
- Digital signage
- Transportation
Videos
Package Outline
게시일: 2021-06-07
| 갱신일: 2022-03-11
