Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module (COM) features an NXP i.MX 93 processor that includes a 1.5GHz Dual ARM® Cortex®-A55, a 250MHz ARM Cortex-M33, and an ARM® Ethos® U-65 microNPU with NXP’s EdgeLock® secure enclave. The 100-pin QFN-type lead-styled module measures 27mm2 x 2.6mm in height and provides single-sided assembly in an industrial -40°C to +85°C temperature range. The Ka-Ro Electronics QS93 Computer-on-Module (COM) uses a large ground pad on the bottom side for a good return path for all signals.
Features
- NXP i.MX 93 processor
- Dual ARM® Cortex®-A55, 1.5GHz
- ARM Cortex-M33, 250MHz
- ARM Ethos® U-65 microNPU
- NXP’s EdgeLock® secure enclave
- 1GB LPDDR4 RAM
- 4GB eMMC ROM
- Industrial grade
- -40°C to +85°C operating temperature range
- Display support
- LVDS display interface
- 2D GPU: blending/composition, resize, and color space conversion
- Linux OS support
- 27mm2 x 2.6mm height
- QS family pin-compatible
- Connectivity
- 2x USB 2.0
- 2x Gb Ethernet, RGMII
- 1x eMMC/SD
- 2x FlexCAN
- 5x UART, 7x I2C, 4x SPI, 6x PWM, and 1x SAI
- Up to 60x 3.3V general purpose I/O
- MIPI-CSI (2-lane)
- QFN-type lead style with 1mm pitch, 100x pads, and a thermal pad
- Visual solder joint inspection is possible after soldering
- Single-sided assembly
- 3.3V power supply
- Compatible with industrial standard reflow profile for Pb-free solders
i.MX 93 Block Diagram
Related Development Tools
Ka-Ro Electronics QSBASE93 COM Evaluation Kit
Versatile baseboard for the QFN-type QS93 Computer-on-Module (COM).
게시일: 2023-06-30
| 갱신일: 2023-07-20