Amphenol FCI DDR3 Memory Module Sockets
Amphenol FCI Memory Module Sockets accept most industry-standard memory types (DDR, DDR2, DDR3) and form factors, including DIMM, SO-DIMM, and VLP DIMM. These sockets allow convenient memory expansion in servers, workstations, desktop PCs, mobile PCs, and embedded applications in communications and industrial equipment. Amphenol FCI DDR3 Memory Module Sockets accept 240-position DDR3 memory modules per JEDEC MO-269. Low contact resistance versions support the use of RDIMM (registered DIMM) to further reduce power consumption in data communications systems such as servers. The DDR3 memory socket lineup offers various form factors, including VLP (very low profile), providing an overall connector height of less than 20.6mm and complying with JEDEC SO-007 specifications.
Features
- Mechanical voltage keying and end latches for module retention and ejection
- DIMM connectors have low insertion-force socket design that requires less than 24lbs of force for module installation
- Available solder tail options for vertical DDR3 connectors support use of 1.58mm (.062") or 2.36mm (.093") thick motherboards, while press-fit options extend use to thicker motherboards
- Slim latch and connector body designs facilitate optimized airflow
- Contact design protects against stubbing and supports high-speed serial differential signaling at data rates extending to 4.8Gb/s for DDR3
- Low-level contact resistance (LLCR) on DDR3 sockets accepts RDIMM DDR3 modules
- VLP form factors provide connector heights of <21mm above the board, while accepting modules with a seating height of <2.4mm
- RoHS compliant and lead-free process-compatible options available to aid compliance with lead elimination initiatives
Applications
- Data
- Servers communications
- Routers
- Switches
- Base Stations
- Industrial
- Embedded systems
Related Sockets
Amphenol Communications Solutions DDR 메모리 모듈 소켓
JEDEC 산업 표준에 따라 작동하는 광범위한 메모리 소켓을 포괄합니다.