JUMPtec COMe-bKL6 COM Express® Basic Type 6 Module
JUMPtec COMe-bKL6 COM Express® Basic Type 6 Module is a high-performance, feature-rich Computer-on-Module (COM) based on the Intel® 7th Generation Core™/Xeon® E3 v6 family processors. This application-ready module features integrated Intel® HD Graphics with support for three independent displays with up to 4K resolution. This enables developers to create applications that provide excellent user experiences. JUMPtec COMe-bKL6 COM Express® Basic Type 6 Modules' broad scalability of CPU performance grades gives users full flexibility to choose the optimal performance solution that matches their operational requirements.
Both COMe-bKL6 and COMe-bKL6R E2S support up to 32GB of ECC/non-ECC DDR4 memory, resulting in a reduction in overall power consumption compared to DDR3-based COMs. JUMPtec COMe-bKL6R E2S offers industrial-grade features making it an ideal platform for applications in harsh and rugged environments.
The COMe-bKL6 and COMe-bKL6R E2S modules are equipped with JUMPtec’s standard hardware-based embedded Security Solution Approtect, so developers integrating the COMe-bKL6/COMe-bKL6R E2S can more easily harden their application against a wide variety of security risks.
Features
- COMPLIANCE COM Express® basic, pin-out type 6
- 125mm x 95mm dimensions
- CPU Options
- Intel® Xeon® E3-1505M v6, 4x 3.0GHz (4.0GHz), GT2, 45/35W
- Intel® Xeon® E3-1505L v6, 4x 2.2GHz (3.0GHz), GT2, 25W
- Intel® i7-7820EQ Core™ i7, 4x 3.0GHz (3.7GHz), GT2, 45/35W
- Intel® i5-7440EQ Core™ i5, 4x 2.9GHz (3.6GHz), GT2, 45/35W
- Intel® i5-7442EQ Core™ i5, 4x 2.1GHz (2.9GHz), GT2, 25W
- Intel® i3-7100E Core™ i3, 2x 2.9GHz, GT2, 35W
- Intel® i3-7102E Core™ i3, 2x 2.1GHz, GT2, 25W
- 2x DDR4-2400 SO-DIMM up to 2x 16-GByte (non-ECC/ECC) main memory
- Chipset Intel® Mobile CM238 / Intel® Mobile QM175 (Core™ i5 & Core™ i7)
- Intel® HD Graphics P630 (GT2) graphics controller
- Intel® I219LM Ethernet controller
- 10/100/1000 MBit Ethernet
- 4x SATA3 6Gb/s hard disk
- 8x PCIe x1, 1x PEG x16
- Panel signal
- DDI1: DP++
- DDI2: DP++
- DDI3: DP++
- VGA: -
- LVDS: Dual channel 18/24bit
- 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0
- 2x serial interface (RX/TX only)
- Intel® High Definition Audio
- SPI, LPC, SMB, Fast I2C, Staged Watchdog, RTC common features
- AMI Aptio V BIOS
- 93% relative humidity at 40°C, non-condensing (according to IEC 60068-2-78)
- vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM175 Chipset
- ACPI 4.0, S5 Eco power management
- 8.5V to 20V wide-range, single-supply power
- Special features
- POSCAP capacitors
- Trusted Platform Module TPM 2.0
- Security chip
- 4K resolution
- Flexible PEG lane configuration by setup option
- Rapid shutdown
- Industrial temperature grade versions
- Windows® 10, Linux, VxWorks operating systems
- 0°C to +60°C commercial temperature range
- -40°C to +85°C industrial temperature range (COMe-bKL6R E2S only)
Applications
- Internet of Things (IoT)
- Industry 4.0
Block Diagram
게시일: 2019-10-22
| 갱신일: 2025-10-29