특징
- Data rates scalable up to 400Gbps (25Gbps over 16-lanes) support high-bandwidth (fat pipe) next-generation applications
- Enables 4.4TBps with 11 modules on a line card
- Supports next-generation 400GbE
- Designed to accept a broad range of customer-specified thermal modules and heat sinks
- Provides excellent thermal management
- Elastomeric gasket provides superior EMI containment and suppression
- Straight, back-route footprint with 0.75mm pitch provides industry-leading port-count density with close placement along with the panel
- Small pitch eliminates footprint side-routing
- Press-fit connector ensures a robust and simple board termination
애플리케이션
- Telecommunication
- Core switches
- Routers
- Data centers
- Enterprise computing
- Top of Rack (TOR) switches
- Other Ethernet applications requiring 400Gbps interfaces
Additional Resources
게시일: 2016-11-07
| 갱신일: 2022-03-11

