특징
- 다양한 전력(150.0A, 80.0A, 40.0A) 제공
- 인치당 350.0A 전류 밀도
- 수명이 다한 시점에서 1mΩ 미만의 저항(평면-평면)
- 압인 및 솔더-보드 종단
- 주조 또는 플라스틱 가이드
애플리케이션
- Telecommunication equipment
- Hubs
- Cellular base stations
- Switches
- Routers
- Data-communication equipment
- High-end servers
- Rack servers
- Power supplies
사양
- Voltage
- 250V signal module
- 600V for 150.0A module
- Multi-path
- 450V for the 80.0A module
- 600V for the 40.0A module
- Current at +30°C temperature rise
- 3.0A per circuit in the signal module (24 to 64 circuits)
- 150.0A module
- 40.0A per circuit multi-path (4 circuits)
- 40.0A per circuit for the 80.0A module (2 circuits)
- 40.0A module
- Contact resistance range per blade
- 0.16mΩ to 10.0mΩ initial
- 0.25mΩ to 10.0mΩ delta
- 0.41mΩ to 20.0mΩ end of life
- 5000MΩ minimum insulation resistance
- 120g to 2920g mating force range
- 65g to 1720g unmating force range
- 225g contact retention
- 50-cycle durability
- -40°C to +105°C operating temperature range
- UL 94V-0 rated
- LCP housing
- Copper (Cu) Alloy contacts
- Plating
- 30µ" Gold (Au) minimum in the contact area
- 150µ" Tin (Sn) minimum in the solder tail area
- 50µ" Nickel (Ni) minimum underplating
비디오
추가 자료
게시일: 2017-06-14
| 갱신일: 2025-11-25

