소켓 및 어댑터 신제품

Chip Quik DFN-6 to DIP-6/10 SMT Adapters are built on FR-4 material and include surface-mount male vertical headers, wire wrap, or machine pins. These adapters are designed with a top-side footprint for surface-mount components, while the bottom side includes pads for two single-row surface-mount vertical headers. The SMT adapters offer a UL 94V-0 flammability rating and comply with IPC-A-610 Class II standards. These adapters operate from -40°C to +130°C temperature range and withstand a maximum reflow temperature of +260°C. The SMT adapters are lead-free and are RoHS compliant. These adapters feature a PCB size of 25.4mm x 7.62mm x 1.6mm (IPC0272) and 25.4mm x 12.7mm x 1.6mm (IPC0273).
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Chip Quik DFN-6 to DIP-6/10 SMT AdaptersConstructed using FR-4 material and offer a UL 94V-0 flammability rating.2026-08-03 -
Chip Quik Extra-Narrow SMT-to-DIP AdaptersDesigned to replace obsolete DIP ICs with newer surface-mount components.2026-07-29 -
NXP Semiconductors KITPF09FRDMPGM 프로그래밍 보드PF09 9채널 PMIC(전원 관리 IC)가 탑재된 개발 소켓 보드입니다.2026-04-10 -
Grinn AstraADA-1680 Core Module AdapterIntegrates the AstraSOM‑1680 with the Synaptics Astra Machina Foundation Series demo board.2026-04-07 -
Renesas Electronics FORGEFSTRAP™ 소켓 카드 개발 키트FORGEFSTRAP™ 핀과 Go 구성 개발 보드 간의 연결을 구현합니다.2026-01-19 -
Trenz Electronic CR00240-01-A CRUVI HDMI AdapterIncludes a high-speed level shifter and is based on active DDC Puffer PTN3363BSMP.2025-11-13 -
FRAMOS FPA-4.A/AGX-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NVIDIA Jetson AGX family.2025-01-30 -
FRAMOS FPA-A/P22-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NVIDIA Jetson Orin Nano/NX Devices and Raspberry Pi 5.2025-01-30 -
FRAMOS FPA-A/NDK-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the NXP i.MX8M Plus Developer Kit.2025-01-30 -
FRAMOS FSM:FSA Embedded Image Sensor EcosystemEvaluation and customization with dual-board sensor modules.2025-01-29 -
FRAMOS FPA-A/P24-Kit Processor Adapter KitConnects FSM:GO and the FSM Ecosystem to the Toradex Verdin, Mallow, and Dahlia carrier boards.2025-01-28 -
Renesas Electronics SLG47011V 소켓 어댑터 키트SLG4DVKADV 또는 SLG4DVKLITE GreenPAK 개발 보드와 함께 사용하도록 설계되었습니다.2024-11-25 -
Renesas Electronics AnalogPAK SLG47001V/SLG47003V 어댑터 키트SLG4DVKADV 또는 SLG4DVKLITE GreenPAK 개발 보드와 함께 사용하도록 설계되었습니다.2024-11-25 -
Renesas Electronics GreenPAK™ SLG4752x 혼합 신호 매트릭스다양한 애플리케이션에서 효율적인 혼합 신호 기능을 위해 설계되었습니다.2024-10-21 -
Microchip Technology EV88N31A 어댑터 보드AVR16EB32-CNANO MPPB 어댑터를 평가하도록 설계되었습니다.2024-07-23 -
Chip Quik Socket to DIP AdaptersAvailable in MSOP to DIP, QFN to DIP, and SOIC to DIP configurations.2024-05-31 -
Chip Quik DIP600 SOIC AdaptersFeature-wide and narrow-bodied adapters are available in 8 to 28 Dual In-Line Package (DIP) range.2024-05-14 -
Microchip Technology AC69T88A 5인치 LVDS WVGA LCD 디스플레이 모듈 키트정전식 터치 센서로 MPU Curiosity 보드를 향상시킵니다.2023-11-05 -
ProGrAnalog X-Pod for Xilinx Power Test AdaptorForm Factor Equivalent Device (FFED) for testing AMD Xilinx Versal ACAP VC1902-VSVA2197 FPGAs.2023-10-09 -
ProGrAnalog FFED-VC1902-VSVA2197 AMD Xilinx Power Test AdaptorOffers rapid testing to validate power delivery solutions.2023-10-09 -
ProGrAnalog LSP-Kit-OracADJ-X Kit for XilinxPowered through a 24V barrel jack and connected via a Mini-B USB.2023-10-05 -
Chip Quik Dual Row AdaptersInclude DIP-08 Adapters to dual row 0.35mm pitch stencils to compact series adapters.2023-08-16 -
ProGrAnalog Xilinx 전력 테스트 어댑터과도, 펄스 트레인, 임피던스 및 3D 플롯을 지원하는 GUI로 설계되었습니다.2023-03-20 -
TE Connectivity LGA 4677 소켓PCIe(5세대) 및 DDR5 8채널 지원을 통해 높은 대역폭 요구 사항을 충족하도록 설계되었습니다.2023-01-10
