4 Gbit Memory ICs

Results: 265
Select Image Part # Mfr. Description Datasheet Availability Pricing (KRW) Filter the results in the table by unit price based on your quantity. Qty. RoHS Product Product Type Mounting Style Package / Case Memory Size Interface Type
GigaDevice GD9FU4G8F3AMG2
GigaDevice NAND Flash Non-Stocked
₩15,537.6
Min.: 960
Mult.: 960
NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
GigaDevice GD9FU4G8F3AMGJ
GigaDevice NAND Flash 4Gbit Parallel NAND Flash 3.3V TSOPI-48 Industrial(-40C to +105C) Non-Stocked
₩40,684.8
Min.: 960
Mult.: 960
NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
GigaDevice GD9FU4G8F4DLGI
GigaDevice NAND Flash 4Gbit Parallel NAND Flash 3.3V FBGA-63 Industrial(-40C to +85C) Non-Stocked
₩33,399.6
Min.: 2,100
Mult.: 2,100
NAND Flash SMD/SMT FBGA-63 4 Gbit Parallel
GigaDevice GD9FU4G8F4DMGI
GigaDevice NAND Flash 4Gbit Parallel NAND Flash 3.3V TSOPI-48 Industrial(-40C to +85C) Non-Stocked
₩33,961.2
Min.: 960
Mult.: 960
NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
Zentel Japan DRAM DDR4 4Gb, 256Mx16, 3200 CL22, 1.2V, FBGA-96 Non-Stocked Lead-Time 28 Weeks
₩78,436.8
₩72,508.8
₩70,168.8
₩68,406
Min.: 1
Mult.: 1
DRAM SMD/SMT FBGA-96 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78 Non-Stocked Lead-Time 16 Weeks
₩52,072.8
Min.: 2,420
Mult.: 2,420
DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
₩67,048.8
Min.: 2,420
Mult.: 2,420
DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78 Non-Stocked Lead-Time 24 Weeks
₩52,072.8
Min.: 2,420
Mult.: 2,420
DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
₩67,048.8
Min.: 2,420
Mult.: 2,420
DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3L 4Gb, 512Mx8, 2133 at CL14, 1.35V, FBGA-78 Non-Stocked Lead-Time 24 Weeks
₩55,317.6
Min.: 2,420
Mult.: 2,420
DRAM SMD/SMT FPGA-78 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96 Non-Stocked Lead-Time 16 Weeks
₩52,072.8
Min.: 2,090
Mult.: 2,090
DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 20 Weeks
₩67,048.8
Min.: 2,090
Mult.: 2,090
DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
₩52,072.8
Min.: 2,090
Mult.: 2,090
DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp. Non-Stocked Lead-Time 28 Weeks
₩67,048.8
Min.: 2,090
Mult.: 2,090
DRAM SMD/SMT FPGA-96 4 Gbit
Zentel Japan DRAM DDR3L 4Gb, 256Mx16, 2133 at CL14, 1.35V, FBGA-96 Non-Stocked Lead-Time 24 Weeks
₩55,317.6
Min.: 2,090
Mult.: 2,090
DRAM SMD/SMT FPGA-96 4 Gbit
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s @ 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩60,621.6
Min.: 2,500
Mult.: 2,500
: 2,500
DRAM SMD/SMT BGA-96 4 Gbit
ISSI DRAM 4G, 1.2V, DDR4, 256Mx16, 2400MT/s @ 16-16-16, 96 ball BGA (7.5mm x13.5mm) RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩66,690
Min.: 2,500
Mult.: 2,500
: 2,500
DRAM SMD/SMT BGA-96 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩60,465.6
Min.: 2,500
Mult.: 2,500
: 2,500
DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩88,530
Min.: 2,500
Mult.: 2,500
: 2,500
DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
₩61,869.6
Min.: 136
Mult.: 136
DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩60,465.6
Min.: 2,500
Mult.: 2,500
: 2,500
DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS Non-Stocked Lead-Time 52 Weeks
₩88,998
Min.: 136
Mult.: 136
DRAM SMD/SMT BGA-200 4 Gbit
ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩74,178
Min.: 2,500
Mult.: 2,500
: 2,500
DRAM SMD/SMT BGA-200 4 Gbit
ISSI NAND Flash 4Gb (x8, 4bit ECC), TSOP-48, 3V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩36,566.4
Min.: 1,500
Mult.: 1,500
: 1,500
NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel
ISSI NAND Flash 4Gb (x8, 4bit ECC), TSOP-48, 1.8V, RoHS, IT, T&R Non-Stocked Lead-Time 52 Weeks
Reel
₩38,220
Min.: 1,500
Mult.: 1,500
: 1,500
NAND Flash SMD/SMT TSOP-I-48 4 Gbit Parallel