Parker Chomerics THERM-A-GAP™ TC50 5.0W/m-K Thermal Putty is a high-performance, single-component, dispensable thermal compound that conducts heat between a hot component and a heat sink or enclosure. The TC50 compound offers low thermal impedance at multiple gaps, enabling the use of common heat spreaders. The material's heavy paste-like consistency offers controlled dispensing and can be applied in various thicknesses to meet application needs. Parker Chomerics THERM-A-GAP TC50 5.0W/m-K Thermal Putty features a low compressive force to deform under assembly pressure, which means minimal stress to components, solder joints, and leads. The putty is formulated to accommodate modern electronics and is ideal for automated dispensing machines, rework, and field repair situations.
