THERM-A-GAP® CIP 35 2.5W/m-K Thermal Compound

Parker Chomerics THERM-A-GAP^® Cure-in-Place (CIP) 35 Thermal Compound is a two-component dispensable compound with a 2.5W/m-K thermal conductivity. The CIP 35 compound features 55 Shore A hardness and cools electronics without excessive compressive force in sensitive cooling applications. This versatile liquid can be dispensed by hand or robotically and cured into complex geometries to cool multi-height components on a printed circuit board (PCB) without a molded sheet. The series is available in ready-to-use cartridge systems that eliminate the need for weighing, mixing, and degassing. Parker Chomerics THERM-A-GAP CIP 35 Thermal Compound offers a long shelf life with no settling or degradation of the cure.