모든 결과 (1,094)

선택 이미지 부품 번호 제조업체 설명 데이터시트 구매 가능 정보 가격 (KRW) 수량에 따라 단가별로 테이블의 결과를 필터링합니다. 수량 RoHS
congatec 히트 싱크 Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded 24재고 상태
최소: 1
배수: 1

JUMPtec 컴퓨터 온 모듈 - COM JUMPtec COMe-mAL10 E2 E3940 4E 1재고 상태
최소: 1
배수: 1
congatec 컴퓨터 온 모듈 - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range. 1재고 상태
최소: 1
배수: 1


congatec 히트 싱크 Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole. 7재고 상태
최소: 1
배수: 1

congatec 히트 싱크 Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole. 2재고 상태
최소: 1
배수: 1

congatec 모듈 부속품 Cable Kit for conga-PA5 containing cab-Pico-ITX-USB2.0-Twin, cab-Pico-ITX-Audio Cable Adapter, cab-Pico-ITX-Buttons-LED, cab-Pico-ITX-GPIO, cab-Pico-ITX-RS232, cab-Pico-ITX-RS485, cab-Pico-ITX-External-Power, cab-Pico-ITX-Feature and cab-Pico-ITX-SAT 1재고 상태
최소: 1
배수: 1

congatec CPU 및 칩 냉각기 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread 11재고 상태
최소: 1
배수: 1

congatec CPU 및 칩 냉각기 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole. 5재고 상태
최소: 1
배수: 1

JUMPtec 컴퓨터 온 모듈 - COM JUMPtec COMe mMount Kit 5/8mm 1set 1재고 상태
최소: 1
배수: 1
JUMPtec 컴퓨터 온 모듈 - COM JUMPtec COMe-cVR6 V1202B 1재고 상태
최소: 1
배수: 1
congatec 컴퓨터 온 모듈 - COM COM Express Mini Type10 module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz 2MB L2 cache 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C. 1재고 상태
10예상 2026-11-10
최소: 1
배수: 1

JUMPtec CPU 및 칩 냉각기 HSK COMe-Basic active (w/o HSP) 2재고 상태
42주문 중
최소: 1
배수: 1


JUMPtec 컴퓨터 온 모듈 - COM JUMPtec HSK COMe-bDV7 passive thread 8재고 상태
최소: 1
배수: 1

congatec 히트 싱크 Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. 12재고 상태
최소: 1
배수: 1
congatec 히트 싱크 Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded 4재고 상태
최소: 1
배수: 1

congatec CPU 및 칩 냉각기 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3재고 상태
최소: 1
배수: 1
congatec 히트 싱크 Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs. 3재고 상태
최소: 1
배수: 1

congatec 히트 싱크 Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded 14재고 상태
최소: 1
배수: 1

congatec 히트 싱크 Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. 1재고 상태
최소: 1
배수: 1
congatec CPU 및 칩 냉각기 Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2재고 상태
최소: 1
배수: 1
congatec 컴퓨터 온 모듈 - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U). 2재고 상태
최소: 1
배수: 1

JUMPtec 38017-0000-00-5
JUMPtec 컴퓨터 온 모듈 - COM JUMPtec COMe Mount Kit 5mm 1set 4재고 상태
최소: 1
배수: 1
congatec conga-HPC/mRLP-CSA-B
congatec CPU 및 칩 냉각기 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1재고 상태
최소: 1
배수: 1

JUMPtec 68300-0000-01-0
JUMPtec 컴퓨터 온 모듈 - COM JUMPtec ADA-COME-T7 4x10G KR-RJ45 - DEV-TOOL 2재고 상태
최소: 1
배수: 1
JUMPtec 34014-0000-99-3
JUMPtec 히트 싱크 HSP COMe-mRP10 Cu-core slim through 3재고 상태
최소: 1
배수: 1