SFEM004GB2ED1TO-I-5E-111-STD

Name: Swissbit SFEM004GB2ED1TO-I-5E-111-STD
Brand: Swissbit
SKU: 922-609264
Price: 100152 KRW
Availability: OutOfStock

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Mouser #:

922-609264

Mfr. #:

SFEM004GB2ED1TO-I-5E-111-STD

Mfr.:

Swissbit

Description:

eMMC Industrial Embedded MMC, EM-30 (153-b), 4 GB, 3D TLC Flash, -40C to +85C

Lifecycle:

End of Life:

Scheduled for obsolescence and will be discontinued by the manufacturer.

Datasheet:

SFEM004GB2ED1TO-I-5E-111-STD Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Swissbit SFEM004GB2ED1TO-I-5E-111-STD

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Swissbit
Product Category:	eMMC
RoHS:
Series:	EM-30
Package / Case:	BGA-153
Memory Size:	4 GB
Configuration:	3D TLC
Sequential Read:	320 MB/s
Sequential Write:	240 MB/s
Interface Type:	eMMC 5.1
Supply Voltage - Min:	1.7 V
Supply Voltage - Max:	3.6 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Bulk
Brand:	Swissbit
Dimensions:	13 mm x 11.5 mm x 1.2 mm
Mounting Style:	SMD/SMT
Product Type:	eMMC
Factory Pack Quantity:	1
Subcategory:	Memory & Data Storage
Part # Aliases:	609264

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Filter Document:

Datasheet

SFEM004GB2ED1TO-I-5E-111-STD Datasheet (PDF)

EOL

Product Discontinuation Notification 2026-4-17 (PDF)

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Compliance Codes

CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: 3A991.b.1.a

Origin Classifications

Country of Origin:: Germany
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

EM-30 Series eMMC Memory Devices

Swissbit EM-30 Series eMMC Memory Devices are robust, reliable, and cost-efficient memory solution for embedded applications. These memory devices are fully compliant with JEDEC e·MMC 5.1 Standard (JESD84-B51) and come in 4GB to 256GB device density with multiple partitions in 3D TLC. The EM-30 eMMC memory devices feature a BGA package that is optimized for the most demanding industrial and automotive applications. These memory devices offer solder down form factor for embedded systems delivering performance known from large SSDs at a 3D TLC NAND price point. The 3D TLC NAND price point combined with a smart set of features supporting long-lasting data integrity and reduced total cost of ownership. Typical applications include embedded systems, automotive, EV charging, POS/POI terminals, factory/industrial automation, routers and switches, medical systems, and Internet of Things (IoT).