Results: 91
Select Image Part # Mfr. Description Datasheet Availability Pricing (KRW) Filter the results in the table by unit price based on your quantity. Qty. RoHS
Nordic Semiconductor RF System on a Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, CSP Non-Stocked Lead-Time 20 Weeks
₩2,574
₩2,496
₩2,449.2
Min.: 1,500
Mult.: 1
Nordic Semiconductor RF System on a Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN Non-Stocked Lead-Time 20 Weeks
₩2,823.6
₩2,776.8
Min.: 3,000
Mult.: 1
Nordic Semiconductor RF System on a Chip - SoC Ultra-low-power, low-voltage wireless SoC for Bluetooth LE, QFN Non-Stocked Lead-Time 20 Weeks
₩2,917.2
₩2,823.6
₩2,776.8
Min.: 1,000
Mult.: 1
Fanstel BM05M
Fanstel Bluetooth Modules - 802.15.1 Mini nRF54L05 BLE 6.0 module, 500KB flash, 96 KB RAM, PCB antenna Non-Stocked Lead-Time 10 Weeks
Cut Tape
₩9,235.2
₩8,002.8
₩7,456.8
₩6,988.8
Reel
₩6,084
Min.: 1
Mult.: 1
: 1,000
Nordic Semiconductor NRF54LC10A-QFAA-R7
Nordic Semiconductor RF System on a Chip - SoC Entry-level, ultra-low-power wireless SoC for Bluetooth LE, Matter, Thread, and Zigbee Non-Stocked Lead-Time 20 Weeks
₩2,917.2
₩2,823.6
₩2,776.8
Min.: 1,000
Mult.: 1
Silex Technology Multiprotocol Modules Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6 Non-Stocked Lead-Time 34 Weeks
Reel
₩42,790.8
Min.: 500
Mult.: 500
: 500
Silex Technology Multiprotocol Modules IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy Non-Stocked Lead-Time 34 Weeks
₩57,985.2
₩53,118
₩48,687.6
₩45,146.4
Min.: 1
Mult.: 1
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace. does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
Reel
₩42,790.8
Min.: 500
Mult.: 500
: 500
Silex Technology Multiprotocol Modules the option to attach an antenna via a trace does not include the u.Fl connector Non-Stocked Lead-Time 34 Weeks
₩57,985.2
₩53,118
₩48,687.6
₩45,146.4
Min.: 1
Mult.: 1
Quectel Bluetooth Modules - 802.15.1 BT6.0, 1st generation RF coaxial connector*2,256KB SRAM,1MB internal flash,Tx power 10dBm,-40? +105? Non-Stocked Lead-Time 18 Weeks
Reel
₩10,576.8
₩10,030.8
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB Non-Stocked Lead-Time 16 Weeks
Reel
₩9,874.8
₩9,703.2
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax Non-Stocked Lead-Time 16 Weeks
Reel
₩9,937.2
₩9,765.6
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB Non-Stocked Lead-Time 16 Weeks
Reel
₩11,559.6
Min.: 1,000
Mult.: 1,000
: 1,000
Quectel Multiprotocol Modules Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax Non-Stocked Lead-Time 16 Weeks
Reel
₩11,778
Min.: 1,000
Mult.: 1,000
: 1,000
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm Non-Stocked Lead-Time 18 Weeks
Reel
₩20,919.6
Min.: 500
Mult.: 500
: 500
Quectel Multiprotocol Modules Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm Non-Stocked Lead-Time 18 Weeks
Reel
₩24,523.2
Min.: 500
Mult.: 500
: 500