특징
- Ultra-small leadless surface mount package (0.6 x 0.3mm)
- Ultra-low profile package (0.3mm)
- Ideally suited for automated assembly processes
- Low leakage current, suitable for battery-powered applications
- Totally lead-free & fully RoHS compliant
- Halogen and antimony-free “Green” Device
- Qualified to AEC-Q101 standards for high-reliability
사양
- Case X3-DFN0603-2
- Case material molded plastic, “Green” molding compound
- 94V-0 UL flammability classification rating
- Moisture sensitivity level 1 per J-STD-020
- Terminal connections cathode bar
- Terminals finish matte tin over the copper lead-frame
- Solderable per MIL-STD-202, method 208
- Weight 0.2mg (approximate)
Additional Resources
게시일: 2017-10-25
| 갱신일: 2024-02-19

