HF300P-0.0015-00-122

Bergquist Company
951-HF300P0001500122
HF300P-0.0015-00-122

제조업체:

설명:
열 인터페이스 제품 Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF1600P/300P

ECAD 모델:
무료 라이브러리 로더를 다운로드하여 이 파일을 ECAD 도구용으로 변환하십시오. ECAD 모델에 대해 자세히 알아보기

구매 가능 정보

재고:
재고 없음
공장 리드 타임:
최소: 1793   배수: 1
단가:
₩-
합계:
₩-
예상 관세:
본 제품의 배송비는 무료

가격 (KRW)

수량 단가
합계
₩640.8 ₩1,148,954
₩589 ₩1,472,500

제품 속성 속성 값 속성 선택
Bergquist Company
제품 카테고리: 열 인터페이스 제품
RoHS:  
Phase Change Materials
Non-standard
Silicone Elastomer
5 kVAC
Green
+ 150 C
0.127 mm
48 MPa
UL 94 V-0
300P / THF 1600P
브랜드: Bergquist Company
설계 중점 대상: Electronic Components and Heat Sink
제품 유형: Thermal Interface Products
팩토리 팩 수량: 1
하위 범주: Thermal Management
상표명: Hi-Flow
부품번호 별칭: BG421422 HF300P1.5-122 2190519
단위 중량: 283 mg
제품을 찾음:
유사 제품을 표시하려면 확인란을 하나 이상 선택하십시오.
이 카테고리에 유사 제품을 표시하려면 확인란을 하나 이상 선택하십시오.
속성 선택됨: 0

USHTS:
3921904090
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

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Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.