Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

결과: 30
선택 이미지 부품 번호 제조업체 설명 데이터시트 구매 가능 정보 가격 (KRW) 수량에 따라 단가별로 테이블의 결과를 필터링합니다. 수량 RoHS 타입 위치 수 종단 스타일 IP 등급
EDAC D-Sub 표준 커넥터 632 Series right angle D-Sub receptacle connector, 15 socket type contacts, .121" (3.08mm) footprint, standard insulator, #4-40 UNC threaded standoffs 재고 없음
최소: 1
배수: 1

EDAC D-Sub 혼합 접촉 커넥터 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, solder cup tails, nickel plated shell 재고 없음
최소: 1
배수: 1
11 Position Solder Tail
EDAC D-Sub 고밀도 커넥터 633M Series right angle D-Sub plug connector, 15 machined pin type contacts, 3.50mm PCB tail length, black insulator 재고 없음
최소: 1
배수: 1

EDAC D-Sub 표준 커넥터 634 Series right angle D-Sub receptacle connector, 44 socket type contacts, 30 microinches of gold plating 비재고 리드 타임 17 주
최소: 1
배수: 1

EDAC D-Sub 고밀도 커넥터 637 Series vertical D-Sub plug connector, 15 pin type contacts, #4-40 UNC threaded standoffs and boardlocks 재고 없음
최소: 1
배수: 1

15 Position Through Hole