결과: 144
선택 이미지 부품 번호 제조업체 설명 데이터시트 구매 가능 정보 가격 (KRW) 수량에 따라 단가별로 테이블의 결과를 필터링합니다. 수량 RoHS ECAD 모델 제품 타입 위치 수 피치 열 수 열 간격 장착 스타일 종단 스타일 장착 각도 접촉 젠더 접촉 도금 메이팅 포스트 길이 종단 포스트 길이 시리즈 상표명 적용 최저 작동온도 최고 작동온도 포장
Molex 헤더 및 와이어 하우징 C-Grid Shrd Hdr SR V Hdr SR Vt Au-F 3Ckt 2,835재고 상태
2,320예상 2026-05-18
최소: 1
배수: 1

Headers Shrouded 3 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 7P R/A SR SHRD AU 1,870재고 상태
최소: 1
배수: 1

Headers Shrouded 7 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 30P V DR SHRD TIN 178재고 상태
최소: 1
배수: 1

Headers Shrouded 30 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 C-GRID III 5 CKT SHR 117재고 상태
950예상 2026-02-25
최소: 1
배수: 1

Headers Shrouded 5 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 8P V SR SHRD TIN 45재고 상태
3,120예상 2026-02-18
최소: 1
배수: 1

Headers Shrouded 8 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 10P V SR SHRD AU-E 443재고 상태
최소: 1
배수: 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 3P R/A SR SHRD TIN 254재고 상태
최소: 1
배수: 1

Headers Shrouded 3 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 2P R/A SR SHRD AU 1,242재고 상태
최소: 1
배수: 1

Headers Shrouded 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 3P R/A SR SHRD AU 294재고 상태
최소: 1
배수: 1

Headers Shrouded 3 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 12P V DR SHRD TIN 48재고 상태
8,304주문 중
최소: 1
배수: 1

Headers Shrouded 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 18P V DR SHRD TIN 841재고 상태
최소: 1
배수: 1

Headers Shrouded 18 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 26P V DR SHRD TIN 190재고 상태
2,880예상 2026-06-01
최소: 1
배수: 1

Headers Shrouded 26 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 34P V DR SHRD TIN 226재고 상태
최소: 1
배수: 1

Headers Shrouded 34 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 18CKT VERT DR HDR SHROUDED 204재고 상태
최소: 1
배수: 1

Headers Shrouded 18 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 HDR 2X03P RA SHRD FULLY LOADED 1,103재고 상태
최소: 1
배수: 1

Headers Shrouded 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 HDR DUAL R/A 10P shrouded fully load 678재고 상태
3,360예상 2026-04-27
최소: 1
배수: 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 14P R/A DR SHRD TIN 384재고 상태
최소: 1
배수: 1

Headers Shrouded 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 16P R/A DR SHRD TIN 479재고 상태
최소: 1
배수: 1

Headers Shrouded 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 24P R/A DR SHRD TIN 320재고 상태
최소: 1
배수: 1

Headers Shrouded 24 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 26P R/A DR SHRD TIN 74재고 상태
2,880예상 2026-05-14
최소: 1
배수: 1

Headers Shrouded 26 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 HDR DUAL R/A 10P 558재고 상태
2,688예상 2026-07-17
최소: 1
배수: 1

Headers Shrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 12P R/A DR SHRD AU 353재고 상태
1,440예상 2026-04-30
최소: 1
배수: 1

Headers Shrouded 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 C-Grid Shrd Hdr DR R Hdr DR RA Au-F 14/14 657재고 상태
최소: 1
배수: 1

Headers Shrouded 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90130 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 2.54MM CGRIDIII HDR 7P V SR SHRD TIN 280재고 상태
최소: 1
배수: 1

Headers Shrouded 7 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 6.75 mm (0.266 in) 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray
Molex 헤더 및 와이어 하우징 HDR STRT SINGLE 2P 489재고 상태
3,040주문 중
최소: 1
배수: 1

Headers Shrouded 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 2.9 mm (0.114 in) 90136 C-Grid Wire-to-Board, Signal - 55 C + 125 C Tray