Hirose IT3 High-Speed BGA Mezz Connectors transmit differential, single-ended, and power through one package. The stackable IT3 series (ranging from 15mm to 40mm) provides reliable connections for today's data rates, including PCIe and XAUI, as well as 10+ Gbps systems. Hirose IT3 High-Speed BGA Mezz Connectors offer a staggered 1.5mm x 1.75mm ball grid array. Additional features include 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability. The IT3 system features three basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB, and different height interposer assemblies are selected to achieve the needed height between the PCBs.
