Molex Mobile Device Spring Clips provide high durability interconnect performance over a wide working range of 0.25mm to 2.00mm for increased design flexibility with specific loading control. The 105386 and 105439 components feature an anti-snag design that prevents contact damage during assembly processing. The 105385 series features kinked ribs to prevent solder wicking. Molex Mobile Device Spring Clips are designed for smartphones and mobile devices and are also ideal for industrial applications.
