모든 결과 (1,059)

컴퓨터 온 모듈 - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

컴퓨터 온 모듈 - COM Q7 INTEL ATOM E3845 BAY TRAIL COM TEMP

CPU 및 칩 냉각기 COMe Active Uni Cooler (w/o HSP)

컴퓨터 온 모듈 - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. DisplayPort interface instead of LVDS. Commercial temperature ran

히트 싱크 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package.Threaded version (standoffs, M2.5)Intended for following QMX6 modules: * conga-QMX6/DC-1G eMMC4 (P/N 016102A) * conga-QMX6/QC-1G eMMC4 (P/N 0

CPU 및 칩 냉각기 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

컴퓨터 온 모듈 - COM Qseven module with Intel Atom x6212RE dual core processor with 1.2GHz core frequency, 1.5MB cache, 4GB 3.200MT/s LPDDR4x onboard memory and 32GB eMMC 5.1 onboard flash. Industrial grade temperature range from -40 C to 85 C.

히트 싱크 * Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded

히트 싱크 Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.

컴퓨터 온 모듈 - COM JUMPtec COMe-m4AL10 E2 E3930 2G

컴퓨터 온 모듈 - COM headless Intel Atom E3805 dual core processor, 1.33GHz, 1MB L2 cache, 2GB 1067MT/s DDR3L onboard single channel memory and 4GB eMMC onboard flash Industrial grade temperature range from -40 C to 85 C

CPU 및 칩 냉각기 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.