9703-4X10

3M Electronic Specialty
517-9703-4X10
9703-4X10

제조업체:

설명:
접착 테이프 Electrically Conductive Adhesive Transfer Tape 4 in x 10yd Roll

재고 상태: 17

재고:
17
즉시 배송 가능
주문 중:
33
예상 2026-03-09
공장 리드 타임:
8
표시된 것보다 많은 수량에 대한 추정 공장 생산 시간입니다.
최소: 1   배수: 1
단가:
₩-
합계:
₩-
예상 관세:
본 제품의 배송비는 무료

가격 (KRW)

수량 단가
합계
₩398,375.6 ₩398,376
₩350,575.2 ₩4,206,902
₩335,128.4 ₩9,048,467
₩326,456 ₩16,649,256
102 견적

제품 속성 속성 값 속성 선택
3M
제품 카테고리: 접착 테이프
RoHS:  
Tapes
Conductive
Electrically Conductive Adhesive Transfer Tape
Acrylic
4 in
101.6 mm
10 yd
9.14 m
브랜드: 3M Electronic Specialty
제품 유형: Adhesive Tapes
시리즈: 9703
팩토리 팩 수량: 3
하위 범주: Supplies
부품번호 별칭: 7100306861
단위 중량: 431 g
제품을 찾음:
유사 제품을 표시하려면 확인란을 하나 이상 선택하십시오.
이 카테고리에 유사 제품을 표시하려면 확인란을 하나 이상 선택하십시오.
속성 선택됨: 0

KRHTS:
4811410000
CNHTS:
3919109900
USHTS:
4811412100
JPHTS:
481141000
MXHTS:
4811410100
BRHTS:
48114190
ECCN:
EAR99

9703 Series Electrically Conductive Adhesive Tapes

3M™ 9703 Series 1510-001G-011 Electrically Conductive Adhesive Transfer Tapes feature adhesive-coated liners for a more conformable and flexible double-sided tape. These transfer tapes offer Z-axis-based conductivity in a variety of conductive adhesives, carriers, and fillers to provide enhanced EMI performance. The adhesive transfer tapes electrically connect and mechanically bond medium-pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB), or LCD screens. The electrically conductive adhesive transfer tapes are available in multiple thicknesses and provide EMI/RFI shielding and grounding across various frequencies.

Thermally Conductive Interface Pads

3M™ Thermally Conductive Interface Pads are designed to provide a preferential heat transfer path between heat-generating components, heat sinks, and other cooling devices. The interface pads consist of a highly conformable and slightly tacky silicone elastomer with thermally conductive ceramic particles, which help in providing enhanced thermal conductivity and excellent insulation performance. The high thermal conductivity and dielectric strength pads can be die-cut to fit individual applications. Typical applications include Integrated Circuit (IC) chip packaging heat conduction, heat sink interface, LED board Thermal Interface Material (TIM), and Chip ON Film (COF) heat conduction.