Amphenol FCI ExaMax® 고속 인터커넥트 시스템

Amphenol FCI ExaMAX® 고속 인터커넥트 시스템은 25Gb/s에서 최대 56Gb/s까지의 신호 속도에서 확장할 수 있는 고속 백플레인과 IO 성능을 제공합니다. ExaMAX® 시스템은 백플레인, 미드플레인, 미드플레인 직교, 직접 직교, 케이블 연결된 백플레인, 코플래너 및 메자닌 애플리케이션을 비롯한 다양한 시스템 아키텍처와 호환됩니다.

특징

  • Meets industry specifications such as Optical Internetworking Forum (OIC), PCI Express, SATA, Fiber Channel, Infiniband, Ethernet, SAS, IBTA, and IEEE
  • Minimizes impedance discontinuities
  • Mating compatible with ExaMAX VS, ExaMAX+, and EXAMAX2
  • Provides low crosstalk while eliminating insertion loss resonances
  • Reduces mating force up to 65% compared to traditional blade and beam designs
  • Durable, reliable mating interface design eliminates crushed pins
  • 2mm pitch for high-density application
  • 3mm pitch enables quad routing and lowers PCB cost
  • Optimizes PCB routing
  • Integrates high-speed and low-speed signals and power in the same connector
  • Optimizes electrical performance and aspect ratio
  • Wide product range for various packaging options
  • Data rates scalable from 25Gb/s to 56Gb/s to support system upgrades without costly redesigns
  • Mating compatible mating interface for 112Gb/s with EXAMAX2 connectors
  • 92Ω and 85Ω nominal impedance
  • Beam-on-beam interface
  • Hermaphroditic mating interface protects mating beams
  • Modular, hard metric connector block design
  • Zero skew in-pair
  • Additional signal pin per column
  • 0.36mm (finished hole) high-speed signal PCB hole 
  • 0.5mm (finished hole) ground pin PCB hole
  • 12 to 128 differential pair node connector
  • Integrated guide design

애플리케이션

  • Hubs
  • Switches
  • Router
  • Optical transport
  • Wireless infrastructure
  • Servers
  • External storage system
  • Supercomputers
  • Industrial and instrumentation
  • Test equipment
  • Emulation equipment

사양

  • 20mV max., 100mA current contact resistance
  • 1000MΩ at 500VDC insulation resistance
  • 500VDC dielectric withstanding voltage
  • 0.5A/contact current rating

비디오

게시일: 2016-11-28 | 갱신일: 2025-01-21