FS3L50R07W2H3FB11BPSA1
제품 사양을 참조하세요
제조업체:
설명:
IGBT 모듈 650 V, 50 A 3-level IGBT module
재고 상태: 14
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재고:
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14 즉시 배송 가능예기치 않은 오류가 발생했습니다. 나중에 다시 시도하십시오.
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공장 리드 타임:
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10 주 표시된 것보다 많은 수량에 대한 추정 공장 생산 시간입니다.
가격 (KRW)
| 수량 | 단가 |
합계
|
|---|---|---|
| ₩89,541.8 | ₩89,542 | |
| ₩73,846.8 | ₩738,468 | |
| ₩58,297.8 | ₩6,121,269 | |
| 2,505 | 견적 |
데이터시트
Application Notes
- Aging stability of various heatconducting pastes for use with modules without baseplates (PDF)
- Application Note IGBT Definition of Junction Temperature (PDF)
- Application of screen print templates to paste thermal grease within IGBT modules (PDF)
- Assembly Instructions - Easy-PressFIT Modules (PDF)
- Deadtime calculation for IGBT Modules (PDF)
- Driving IGBTs with unipolar gate voltage (PDF)
- Industrial IGBT Modules Explanation of Technical Information (PDF)
- Transient Thermal Measurements and thermal equivalent circuit models (PDF)
- Using the NTC inside a power module (PDF)
Other
Product Catalogs
- 3-Level Inverter Modules (PDF)
- Easy & Econo Power Modules (PDF)
- Easy B-series and Easy750 Power modules (PDF)
- Infineon's Latest Power and Sensing Guide (PDF)
- Modules for Photovoltaic String and Multi-String Inverters (PDF)
- PressFIT - Our established, reliable mounting technology (PDF)
- Solutions for Industrial Drives (PDF)
- Solutions for Uninterruptible Power Supply (UPS) Systems (PDF)
Technical Resources
- Correlating NTC-Reading and Chip-Temperature in Power Electronic Modules (PDF)
- Impact of module parasitics on the performance of fast-switching devices (PDF)
- PressFIT Technology, a Solderless Method for Mounting Power Modules (PDF)
- Reliability of PressFIT connections (PDF)
- The challenge of accurately analyzing thermal resistances (PDF)
- Thermal Heat Sink Interface of IGBT Modules w/o Base Plate (PDF)
- Using 650-V High Speed 3 IGBTs in Power Modules for Solar Inverter Performance Improvement (PDF)
Test/Quality Data
- USHTS:
- 8541210095
- TARIC:
- 8541290000
- ECCN:
- EAR99
대한민국
